September 3, 2025

Opcenter Execution 2504 Release Highlights

Jan Tichý
Solution Architect & CEO

The Opcenter Execution 2504 Release is here! Although slightly delayed, it introduces powerful new tools and enhancements across the Core Platform, Semiconductor, and Electronics domains. From improved database visualization to advanced SPC features, here are my top picks and commentary.

🌟 Core Platform

Entity Relationship Diagram Tool

  • Visualize your schema or object model (MDB).
  • Excellent for onboarding, debugging, or reverse engineering your MES model.

Next-Gen Purge Tool (Wrapper around Benny Chia solution)

  • Rule-based purge, archive, and restore.
  • Works with MSSQL.
  • (Note: Benny’s original tool also works with Oracle.)

Carrier Maintenance

  • Track carrier usage and quantity to ensure smooth material handling.

BOM Import via CSV

  • Adds to the Excel Loaders with a simpler, flexible approach.
  • A solid method worth replicating for more import scenarios.

REST API Enhancement

  • Action Attributes now supported for Shopfloor Transactions, opening up stronger integration possibilities.

🌟 Semiconductor

Remaining Process Time

  • New feature for better production monitoring.

SPC Enhancement

  • Dynamic subgrouping at lot or wafer-level, improving quality control.

Factory Hierarchy View

  • Get an overview from Enterprise level down to individual resources/equipment.

Rework Logic Update
‼️ Must-have patch for SEMI!
Still doesn’t cover all edge cases, but a significant step forward.

🌟 Electronics

Exposure Duration Propagation

  • Propagates exposure time from all subproducts to the final product.
  • A valuable feature for ensuring compliance and traceability.

Subscribe to our
newsletter for actionable tips!